苹果手机芯片A16相比A15提升多少性能SG-210SCBA爱普生晶振X1G004591A01300
苹果手机芯片A16相比A15提升多少性能SG-210SCBA爱普生晶振X1G004591A01300
那么基本上认为苹果这里比的就是单核性能成绩了.如果是单核性能,那苹果确实有炫耀的资本.但基于苹果说的,即A16的单核性能相比于骁龙8+领先40%,那么A16的Geekbench5单核性能得分估计在1835分左右.
标尺也没有而且还不是跟去年的A15比,而是找来A13和不明身份的竞品,是单核还是多核性能也不说.这个竞品我们假设为高通骁龙8+Gen1.从Geekbench5的CPU跑分测试来看,A13芯片iPhone11的CPU单核性能得分大约1320分,多核3300分左右；爱普生晶振而目前性能释放还不错的骁龙8+Gen1手机这两个得分分别是1310分和4200分.
苹果在发布会上说A16是智能手机中最快的芯片,而竞争对手还在追赶A13芯片的性能—那是我们3年前用在iPhone11上的芯片.6核CPU的A16更进一步,相比于竞争对手性能领先40%.如果真的是这样好像非Pro版的iPhone14不换芯片也可以接受?
SG-210SCBA爱普生晶振X1G004591A01300,苹果手机芯片A16与A15晶振
爱普生有源晶振编码
型号
频率
长X宽X高
输出波
电源电压
工作温度
频差
X1G004591A00400
SG-210SCBA
8.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A00600
SG-210SCBA
37.007000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-100 ppm
X1G004591A00700
SG-210SCBA
27.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A00900
SG-210SCBA
20.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A01000
SG-210SCBA
33.333000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A01300
SG-210SCBA
25.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A01700
SG-210SCBA
4.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A02000
SG-210SCBA
20.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A02100
SG-210SCBA
33.333300 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A02300
SG-210SCBA
16.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A02400
SG-210SCBA
25.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A02500
SG-210SCBA
25.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A02700
SG-210SCBA
33.300000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A02800
SG-210SCBA
48.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A03100
SG-210SCBA
25.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-100 ppm
X1G004591A03300
SG-210SCBA
10.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 125 °C
+/-100 ppm
X1G004591A03600
SG-210SCBA
33.333300 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A03700
SG-210SCBA
14.745600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A03800
SG-210SCBA
37.007000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A04000
SG-210SCBA
24.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A04100
SG-210SCBA
16.000000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A04900
SG-210SCBA
24.576000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-100 ppm
X1G004591A05000
SG-210SCBA
22.579200 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 105 °C
+/-50 ppm
X1G004591A05100
SG-210SCBA
14.745600 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
X1G004591A05200
SG-210SCBA
24.576000 MHz
2.50 x 2.00 x 0.90 mm
CMOS
2.700 to 3.600 V
-40 to 85 °C
+/-50 ppm
A16相比A15大概有多大提升,只有更贵Pro系列才用上了更高端的A16芯片.目前A16芯片的已知信息包括：160亿晶体管；台积电4nm工艺（真·4nm,N4P）；CPU2大核、4小核；GPU5核心,提升了50%的内存带宽来自LPDDR5；NeuralEngine16核心,日本进口晶振也就是AI单元,标称性能17TOPS；新的显示引擎（DisplayEngine）用以支持或显示屏幕（LTPO）最低1Hz刷新率、Always-On特性、DynamicIsland动画抗锯齿、屏幕更高的峰值亮度等；新的ISP用以支持新的4800万像素摄像头,并且能够联合CPU、GPU、NeuralEngine和ISP异构进行最高每张照片4万亿次操作.SG-210SCBA爱普生晶振X1G004591A01300,苹果手机芯片A16与A15晶振
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